SMT Equipment Supplier

The BLUIRIS FAI-700  First Article Inspection System quickly and accurately verify First Article Samples. Using advanced optical and computing techniques, the FAI-700  measures properties of an initial sample against the specifications.

PRODUCT FEATURES:

Extra fiducial point positioning of the CCD camera, automatically correct the fixture and product offset, and ultra-high precision positioning;

Double Y platform, which can be controlled separately according to the actual operation.

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Production Overview

The LKing Plus is a high-performance automatic solder paste printing machine specifically engineered for oversized PCB applications. It boasts an industry-leading printing area of up to 2000mm x 510mm, making it the ideal solution for large-scale electronics manufacturing, such as LED light bars and large-format backplanes.

GDK NEO: High-Precision Solder Paste Printer Production Overview

The NEO features a simple, reliable structure designed for high-end SMT applications, with a specific focus on Mini LED production. Engineered for accuracy and ease of adjustment, the NEO facilitates rapid, automatic PIN height adjustments for varying PCB thicknesses.

Technical Specifications: GDK MX Automatic SMT Stencil Printer PCB Parameters Parameter Specification Maximum Board Size (X x Y) 510mm x 510mm Minimum Board Size (X x Y) 50mm x 50mm PCB Thickness 0.

GDK 5M Automatic Solder Paste Printer Production Overview

The GDK 5M Automatic Solder Paste Printer is designed for large-scale PCB production, capable of handling high-precision components such as 0402, 0201, and 01005. It offers superior molding and soldering volume consistency.

Technical Specifications: High-Precision Automatic Stencil Printer PCB Parameters Feature Specification Maximum Board Size (X x Y) 450mm x 350mm Minimum Board Size (X x Y) 50mm x 50mm PCB Thickness 0.

Functions of R730A Large Board Semi-Automatic Soldering Machine

• Stable Temperature Control

  Three temperature zones independently control, heated by convection hot air, the height of the bottom temperature zone is adjustable, the top temperature zone has a built-in vacuum suction nozzle for chip adsorption, with negative pressure monitoring and

Functions of R7850A BGA Soldering Machine

• Multifunctional Control Features

  Industrial PC control, can set a variety of operating modes, real-time display of temperature curve, each curve can be set to more than 12 segments, it can automatically analyze the curve, and automatically save the temperature curve to generate a large number of log files to

Functions of R9100 Super Large Board Disassembly Preheating Platform

• Non-Contact Single-Point Desoldering

  Non-contact desoldering is achieved with the assistance of precision load cells and barometric height measurement, reducing the risk of BGA damage, scrapping, and solder pad abrasion during the desoldering process.

Functions of R8000B Large Precision Surface Mount Rework Station

Independent three-temperature zone, the upper-temperature zone uses ceramic heaters, the preheating zone adopts German imported medium-wave ceramic infrared heating plates like infrared rework station, each plate can be controlled independently, and the

Features of ZQ3500 Automated BGA De-soldering & Reballing Rework Line

• Fully Automated Rework Line

  The complete system is a fully automated rework line, composed of multiple interconnected machines with human–machine control.

Functions of R8650C Fully Automatic BGA/SMD/PCB Soldering Machine

• Multifunctional Control Features

  Achieves fully automatic optical mounting and desoldering. Optional software docking with SAP/ERP systems is available. Features temperature profile analysis using S/N (Serial Number) for traceability.

Specification of R7220A IR Infrared BGA Rework Station (ZM R6200C)